Top 10 BMS CAN chip suppliers in the world
Top 10 BMS CAN chip suppliers in the world in 2023
| 1 | NXP |
| 2 | TEXAS Instruments |
| 3 | Infineon |
| 4 | Renesas |
| 5 | ST |
| 6 | ONSEMI |
| 7 | INGENIC |
| 8 | SITCORES |
| 9 | NOVOSNS |
| 10 | 3PEAK |
NXP
| Established date | 2006 |
| Global headquarters | Eindhoven, the Netherlands |
| Company website | www.nxp.com.cn |
NXP Semiconductors was founded in 2006 and is headquartered in Eindhoven, the Netherlands. NXP can currently provide semiconductor, system and software solutions; used in automobiles, mobile phones, smart identification applications, TVs, set-top boxes and other electronic devices.
NXP has about 30,000 employees in more than 30 countries and regions around the world, and has R&D centers in France, the United States, India, Brazil and China. The R&D centers in China are mainly in Shanghai, Suzhou, Tianjin and other places, and there is a leading-edge factory in Tianjin. In addition, there are offices in Beijing, Xi’an, Shenzhen, Chongqing and other places.
In 2015, NXP merged with another leading semiconductor company “Freescale”, enabling NXP to further expand its business in the Internet of Things and automotive fields, and focus on the development of safe and reliable edge computing, connection technology and efficient power management solutions. NXP ranks first in the 2021 list, with MCU sales reaching $3.795 billion.
NXP products mainly include multiple products based on Arm® processors, i.MX application processors, and S32 automotive electronic processing platforms. The product portfolio provides high integration, extensive software and hardware support, and comprehensive performance.
TEXAS Instruments
| Established date | 1930 |
| Global headquarters | Texas, USA |
| Company website | www.ti.com.cn |
Texas Instruments is a semiconductor multinational company in Texas, USA. Founded in 1930, it is famous for developing, manufacturing and selling semiconductor and computer technology.
Texas Instruments (TI) is headquartered in Dallas, Texas, USA, and has manufacturing, design or sales organizations in more than 25 countries. In the first half of 2018, Texas Instruments ranked 9th among semiconductor manufacturers in the world, with a market value of more than 100 billion U.S. dollars, ranking 82nd in the world. In 2022, Texas Instruments’ annual revenue has reached 200.28 million U.S. dollars.
TI is mainly engaged in the research, manufacture and sales of innovative digital signal processing and analog circuits. TI has 15 manufacturing facilities around the world, including 12 wafer fabrication plants, 7 assembly and test plants, and multiple bump and probe plants. TI has also invented process and packaging technologies that help build highly differentiated components, which can effectively extend the life of products.
TI designs, manufactures, tests and sells analog and embedded semiconductor chips, and has created differentiated applications for nearly 100,000 customers worldwide in markets such as industrial, automotive, personal electronics, communication equipment and enterprise systems.
In addition to the semiconductor business, TI also provides solutions including sensing and control, educational products and digital light source processing. Texas Instruments is the world’s largest manufacturer of digital signal processors (DSP) and analog circuit components, and its analog and digital signal processing technology has a leading position in the world.
Infineon
| Established date | 1999.4 |
| Global headquarters | Munich, Germany |
| Company website | www.infineon.com |
Infineon Technologies was officially established in Munich, Germany on April 1, 1999. It is one of the world’s leading semiconductor companies, focusing on providing semiconductor and system solutions for automotive and industrial power devices, chip cards and security applications.
Infineon’s products master cutting-edge technologies in the fields of analog and mixed signals, radio frequency, power and embedded control devices. On average, 17% of sales are invested in research and development every year, and it has a total of 41,000 patents worldwide.
Infineon’s business covers the world, with branches in Milpitas, California, Singapore in the Asia-Pacific region, and Tokyo, Japan. In fiscal year 2018, the company’s total revenue in the global market was 7.599 billion euros.
Infineon’s products include power devices, ASICs, battery management ICs, Clocks & Timing Solutions, ESD protection and high voltage battery protection, Memories, microcontrollers, radio frequency and wireless control security and smart card solutions, sensors, transistors, diodes, transceivers, Universal Serial Bus, Wireless Connectivity, Software, High Reliability, isolation, etc.
Renesas
| Established date | 2003.1 |
| Global headquarters | Tokyo, Japan |
| Company website | www.renesas.cn |
Renesas is a semiconductor company formed by the merger of Hitachi and Mitsubishi Electric Corporation’s semiconductor division on April 1, 2003, headquartered in Tokyo, Japan.
Renesas combines the advanced technology and rich experience of Hitachi and Mitsubishi in the field of semiconductors, and is the world’s leading supplier of embedded semiconductors for the wireless network, automotive, consumer and industrial markets.
Renesas also established a semiconductor back-end process and design and R&D base in Suzhou, China. The affiliated design and development center is engaged in the design and development of large-scale integrated circuits based on Renesas Technology’s MCU, and has the ability to independently develop MCU products including embedded FLASH ROM.
The main products of Renesas are microcontrollers and microprocessors, Analog Products, automotive products, clocks and timing, interface & connection, memory and logic devices, power management, Programmable Mixed-signal, ASIC & IP Products, RF products, sensor products, Space & Harsh Environment, Wireless Connectivity and so on.
ST
| Established date | 1987 |
| Global headquarters | Geneva, Switzerland |
| Company website | www.st.com |
Founded in 1987, ST Group was formed by the merger of SGS Microelectronics from Italy and Thomson Semiconductor from France. It is headquartered in Geneva, Switzerland and is one of the largest semiconductor companies in the world.
Since its establishment, ST has insisted on investing in research and development, and its manufacturing processes include advanced CMOS logic (including derivatives of embedded memory), mixed-signal, analog and power manufacturing processes.
In the field of advanced CMOS, ST will cooperate with the IBM Alliance to develop next-generation manufacturing processes, including 32nm and 22nm CMOS process development, design implementation technology and advanced research for 300mm wafer manufacturing. In addition, ST and IBM will also use the 300mm production facility in Crolles, France to develop high value-added CMOS-derived SoC technology.
In October 2022, ST announced that it will build an integrated silicon carbide (SiC) substrate manufacturing plant in Italy to meet customers’ increasing demand for automotive and industrial silicon carbide components.
ONSEMI
| Established date | 1999 |
| Global headquarters | Phoenix, Arizona, USA |
| Company website | onsemi.cn |
ONSEMI Semiconductor is a premier supplier of high-performance silicon solutions for energy-efficient electronics. The company operates a world-class, value-added supply chain and network of manufacturing plants, sales offices and design centers in key markets in North America, Europe and Asia Pacific.
The company’s product line includes power and signal management, logic, discrete and custom devices, helping customers solve their designs in automotive, communications, computer, consumer electronics, industrial, LED lighting, medical, military/aerospace and power applications.
Specific products include: discrete devices and power modules, MOSFETs, power modules, silicon carbide (SiC), power management, POE powered equipment, signal conditioning and control sensors, motor control, application specific standard products (ASSP), interfaces, wireless connections, timing, logic and memory, gate drivers, AC-DC power conversion, etc.
On July 19, 2023, ONSEMI and BorgWarner, the world’s leading supplier of innovative and sustainable vehicle solutions, reached an expansion of strategic cooperation in silicon carbide (SiC), with a total value of over US$1 billion. BorgWarner plans to integrate ONSEMI’s EliteSiC 1200 V and 750 V power devices into its VIPER power modules.
INGENIC
| Established date | 2005 |
| Global headquarters | Beijing, China |
| Company website | www.ingenic.com.cn |
Beijing INGENIC Integrated Circuit Co., Ltd. was established in 2005. Based on the innovative CPU design technology of the founding team, it quickly realized the industrialization of SoC chips in the consumer electronics market and was listed in May 2011. In 2020, INGENIC completed the acquisition of ISSI of the United States and its sub-brand Lumissil.
ISSI provides high-quality and high-reliability memory products for automotive, industrial and medical fields, including SRAM, DRAM, Nor Flash, 2D NAND Flash and eMMC, with customers all over the world. Lumissi provides chip products such as LED drivers, microprocessors, power management and interconnection for automobiles, home appliances and consumer electronics.
INGENIC continues to invest in computing technologies such as processor technology, multimedia technology and AI technology, and its chips have won a broad market in the fields of intelligent video surveillance, AIoT, industry and consumption, biometrics and educational electronics.
INGENIC will integrate its more than ten years of computing technology and ISSI’s more than 30 years of energy storage solutions, simulation and interconnection technology, and use the company’s complete car-standard chip quality and service system to occupy a leading position in the automotive, industrial, AIOT and other industries.
SITCORES
| Established date | 2012.10 |
| Global headquarters | Hunan, China |
| Company website | www.sitcores.com |
Founded in October 2012 and headquartered in Hunan, SITCORES Electronic Technology Co., Ltd. is a high-tech enterprise specializing in the design of mixed-signal integrated circuits. Its products are widely used in vehicles, drones, robots, Internet of Things, automotive electronics, new energy lithium batteries, security, industrial control, power meters and other fields.
In the field of automotive applications, SITCORES took the lead in launching 5V/3.3V CAN/CAN FD bus interface series chips and LIN bus interface series chips. The series are complete, and it has become the first analog IC manufacturer in China that has both CAN and LIN transceiver chips.
The accumulative shipment volume of SITCORES’s automotive CAN/LIN transceiver chips exceeds 100 million pieces, and it has established business partnerships with more than 10 Chinese and global OEMs and more than 300 Tier1/Tier2 manufacturers.
It has been widely used in automotive BCM, EPS, ADAS, AVAS, BMS, TBOX, OBC, OBD, PEPS and many other fields. SITCORES 5V/3.3V RS485, RS422, RS232 interface series chips are widely used in industry, communication, security and other fields.
The accumulative shipment volume of SITCORES’s automotive CAN/LIN transceiver chips has exceeded 100 million pieces, and it has established business partnerships with more than 10 OEMs and more than 300 Tier1/Tier2 manufacturers at home and abroad. It has been widely used in automotive BCM, EPS, ADAS, AVAS, BMS, TBOX, OBC, OBD, PEPS and many other fields.
NOVOSNS
| Established date | 2013 |
| Global headquarters | Suzhou, China |
| Company website | www.sitcores.com |
NOVOSNS Microelectronics is a high-performance and high-reliability analog and mixed-signal chip company. Since its establishment in 2013, the company has focused on the three major directions of sensors, signal chains, and power management, providing a wealth of semiconductor products and solutions, and are widely used in automotive, industrial, information and communication, and consumer electronics fields.
NOVOSNS’s products include gate drivers, industrial/medical/automotive chips, interfaces, isolation, LED drivers, motor control drivers, power path protection, power supplies, sensors, etc. NOVOSNS provides a wealth of CAN/LIN transceiver solutions, including isolated CAN transceivers, isolated CAN transceivers with integrated isolated power supplies, general-purpose CAN transceivers, and LIN transceivers.
On February 8, 2023, Lubo Automotive Electronics Co., Ltd., jointly invested by NOVOSNS, Continental Group and Qufu Tianbo Group, announced product cooperation. The two parties signed a product cooperation agreement on the localization project of wheel speed sensors, key components of passenger vehicles, and explored in-depth cooperation in the fields of technology and safety.
3PEAK
| Established date | 2022.9.20 |
| Global headquarters | Suzhou, China |
| Company website | www.3peakic.com.cn |
3PEAK(Suzhou) Microelectronics Technology Co., Ltd. is a Sino-US joint venture chip design company headquartered in Suzhou, with R&D branches in Shanghai and Phoenix, Arizona, USA, and sales and technical support departments in Beijing, Shanghai and Shenzhen, China. 3PEAK has strategic cooperation with large-scale professional chip agents, and the sales area covers China, South Korea, and the United States.
Focusing on the design and sales of high-end analog chips, it is committed to the research and development of signal chain analog chips, power management analog chips and digital-analog hybrid analog front-ends, and gradually integrates embedded processors to provide customers with all-round battery solution.
The company’s products include linear products, isolation products, interface products, data converters, linear voltage regulators and references, monitoring power supplies, driver products, DCDC, battery management, cross-search of competing products, etc.
Products are widely used in new energy vehicles, company systems, wired and wireless communication infrastructure, motor drives, medical health, consumer electronics and other fields.
In December 2022, 3PEAK launched the latest CAN transceiver chips with independent research and development and complete independent intellectual property rights – TPT1042 and TPT1051. The products have passed the German C&S compatibility certification. It is the first chip manufacturer in China to obtain C&S compatibility certification for two CAN transceivers at the same time.
